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Kontakt Heat Sink Compound - 20g

£799
The RRP is the manufacturer's recommended retail price of the item.
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Description

Compound to increase the thermal conductivity and the efficient heat dissipation of electronic components.

  • High thermal conductivity
  • Excellent moisture buffer
  • Low metallic impurity content
Specification
Pack dimensions 150x10x50mm
Contents 20g

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    A white syringe labeled Kontakt Heat Sink Compound - 20g with a barcode and red text, used for applying thermal paste to electronic components for optimal heat dissipation.
    AVSL

    Kontakt Heat Sink Compound - 20g

    £799
    Description

    Compound to increase the thermal conductivity and the efficient heat dissipation of electronic components.

    Specification
    Pack dimensions 150x10x50mm
    Contents 20g
    View product
    Description

    Compound to increase the thermal conductivity and the efficient heat dissipation of electronic components.

    • High thermal conductivity
    • Excellent moisture buffer
    • Low metallic impurity content
    Specification
    Pack dimensions 150x10x50mm
    Contents 20g